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RF-PCB 10 LAYER RF-PCB PROCEDURE

INNER LAYER

No LAYER PROCESS No LAYER PROCESS
1 45 DES 1 67 DES
2 45 OXIDE 2 67 OXIDE
3 45 SEMI ATTACH 3 67 SEMI ATTACH
4 45 HOT PRESS 4 67 HOT PRESS
5 45 PUNCHING 5 67 PUNCHING
6 45 BASE BONDING 6 67 BASE BONDING
7 45 HOT PRESS 7 67 HOT PRESS
No LAYER PROCESS No LAYER PROCESS
8 23 DES 8 89 DES
9 23 OXIDE 9 89 OXIDE
10 23 SEMI ATTACH 10 89 SEMI ATTACH
11 23 HOT PRESS 11 89 HOT PRESS
12 23 DES 12 89 DES
13 23 FR4 OPEN-ROUTER 13 89 FR4 OPEN-ROUTER

OUT LAYER

No LAYER PROCESS
14 1~10 BASE BONDING
15 1~10 HOT PRESS
16 1~10 X-RAY DRILL
17 1~10 TRIMMING
18 1~10 LASER
19 1~10 CNC DRILL
20 1~10 DESMEAR
21 1~10 VIA FILL PLATING
22 1~10 HOLE PLUGGING
23 1~10 PSR
24 1~10 PLASMA
25 1~10 ENIG
26 1~10 SILK
27 1~10 BBT
28 1~10 BODY LASER
29 1~10 ROUTER
30 1~10 FINAL INSPECTION
31 1~10 OUTGOING INSPECTION
32 1~10 PACKING