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Item Standard Production Avanced Production
Layer Count / Technology 12 20
Copper Thickness 6µm / 9µm / 12µm / 18µm / 35µm / 70µm / 110㎛(3oz) 3µm / 9µm / 12µm / 18µm / 35µm / 110㎛(3oz) / 180㎛(5oz)
Min. Line / Spacing 50㎛ / 50㎛ (2mil/2mil) 40㎛ / 40㎛ (1.6mil/1.6mil)
Min. Annular Ring 80㎛ (3.2mil) 60㎛ (2.4mil)
Smallest Drill 0.12 mm (4.8mil) 0.1 mm (4mil)
(Laser D/R: 0.05mm)
Smallest Routing Bit 0.8 mm (320mil) 0.6 mm (240mil)
Surfaces ENEPIG, ENIG, HAL, Lead Free Hal, OSP, Immersion Tin, Electro Soft, Hard Gold, Direct Gold, Silver Plating
Other Process Button Plate, Laser Drill, Build-up, Via Fill, HPL, Stack-Via, BVH
EMI Shielding Yes
Adhesive Tape Yes
SMT Service Yes
Certificate ISO 9001:2015, ISO 14001:2015, UL (No. E326531) ISO/IATF16949
Compliance IPC 6013, IPC A600 , RoHS, Reach
Patent (Etching Solution) Patent No. 10-2010-0086461
Patent No. 10-2010-041723-2
Patent No. 10-1967688
Patent No. 10-1951654