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기술능력

기술능력
Category Current Near Term for 1~3 years
Laminate FR-4, FR-5, BT,
Polymide,
Teflon
Glass-free Epoxy/ BT,
PPE, Aramid,
Cyanate Ester, Ceramic
Package P-BGA(OMPAC TYPE)
MCM-BGA
CP-BGA(E-BGA)
U-BGA/CSP
MCM-IVH
BUM-BGA
DCA
MCM-BUM
MLB IVH(Buride/Blind Via)
PCMCIA(16mils/6L)
Metal Core
IVH(Buride/Blind Via)
- Photo/Plasma Via
- PCMCIA(16mils/8L)
Flex-MLB
PCMCIA(16mils/8L)
SINGLE & DOUBLE SIDE FLEXIBLE
ROAD MAP
MOBILE PHONE (LCD MODULE, CAMERA MODULE), DEGITAL CAMERA, KEYPAD, BLU
Min. LINE / SPACE 30㎛/ 30㎛ Mass Procuction
Min. PTH VIA / LAND 50㎛/ 250㎛ Mass Procuction
SURFACE FINISH
  • Electrolytic Ni / Au
  • Electroless Ni / Au
  • Immersion Tin
  • Electrolytic Sn / Pb
  • Electrolytic Ni / Au (Wire Bonding)
  • OSP (Pre Flux)
  • Direct Gold
  • Immersion Sn / Cu
  • Immersion Ag / Au
  • Electrolytic Silver
  • Electrolytic Silver / Au
  • ENEPIG(Electroless Nickel Electroless Palldium Innersion Gold)
  • SPUTTERING Shield Silver Coating
RIGID FLEXIBLE
ROAD MAP
MOBILE PHONE (LCD, CAMERA MODULE), KEYPAD, DEGITAL CAMERA, COMPUTER
LAYER 20 LAYER Mass Production (BVH Inclusion)
Min. INNER LAYER LINE / SPACE 30㎛ / 30㎛ Mass Production
Min. OUT LAYER LINE / SPACE 50㎛ / 50㎛ Mass Production
Min. PTH VIA / LAND 80㎛ / 180㎛ Mass Production
Min. MVH VIA / LAND 50㎛ / 150㎛ Mass Production
SURFACE FINISH
  • Electrolytic Ni / Au
  • Electroless Ni / Au
  • Immersion Tin
  • Electrolytic Sn / Pb
  • Electrolytic Ni / Au (Wire Bonding)
  • OSP (Pre Flux)
  • Direct Gold
  • Immersion Sn / Cu
  • Immersion Ag / Au
  • Electrolytic Silver
  • Electrolytic Silver / Au
  • ENEPIG (Electroless Nickel Electroless Palldium Immersion Gold)
  • SPUTTERING Shield Silver Coating
MULTI LAYER FLEXIBLE
ROAD MAP
MOBILE PHONE (LCD, CAMERA MODULE), KEYPAD, DEGITAL CAMERA, COMPUTER
LAYER 20 LAYER Mass Production (BVH Inclusion)
Min. INNER LAYER LINE / SPACE 30㎛/30㎛ Mass Production
Min. OUT LAYER LINE / SPACE 50㎛ / 50㎛ Mass Production
Min. PTH VIA / LAND 80㎛/180㎛ Mass Production
Min. MVH VIA / LAND 50㎛ / 150㎛ Mass Production
SURFACE FINISH
  • Electrolytic Ni / Au
  • Electroless Ni / Au
  • Immersion Tin
  • Electrolytic Sn / Pb
  • Electrolytic Ni / Au (Wire Bonding)
  • OSP (Pre Flux)
  • Direct Gold
  • Immersion Sn / Cu
  • Immersion Ag / Au
  • Electrolytic Silver
  • Electrolytic Silver / Au
  • ENEPIG (Electroless Nickel Electroless Palldium Immersion Gold)
  • SPUTTERING Shield Silver Coating