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PCB Manufacturing Capability
| Key Functions | Current | Near Term | ||
| Max.Laver for Figid-Flex | 12 Layer | 20 Layer | ||
| Solder Open | Cover Lay | Solder Resist | Cover Lay | Solder Resist |
| 0.4mm | 0.3mm | 0.3mm | 0.2mm | |
| Min.Pattern Width/Space (㎛) | 50 / 50 | 30 / 30 | ||
| Min.PTH Hole Size (mm)/ PAD Dia. | Φ0.15/ 0.25 | Φ0.1/ 0.2 | ||
| Surface Finish | Chemical Gold-hard. | Chemical Sn | Chemical Gold-hard,soft | |
| Elec. Gold-hard&soft | Elec.Sn | |||
| Remark |
Casting type (2 layer) C.C.L Double Access FPC PDP, EL Panel FPC COF (chip on Flex) |
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