Key Functions | Current | Near Term | ||
Max.Laver for Figid-Flex | 12 Layer | 20 Layer | ||
Solder Open | Cover Lay | Solder Resist | Cover Lay | Solder Resist |
0.4mm | 0.3mm | 0.3mm | 0.2mm | |
Min.Pattern Width/Space (§) | 50 / 50 | 30 / 30 | ||
Min.PTH Hole Size (mm)/ PAD Dia. | ¥Õ0.15/ 0.25 | ¥Õ0.1/ 0.2 | ||
Surface Finish | Chemical Gold-hard. | Chemical Sn | Chemical Gold-hard,soft | |
Elec. Gold-hard&soft | Elec.Sn | |||
Remark |
Casting type (2 layer) C.C.L Double Access FPC PDP, EL Panel FPC COF (chip on Flex) |